Course Catalogue

Engineering

To develop an understanding of the state-of-the-art CMOS devices and systems. To gain knowledge in the fabrication and testing of microelectronic devices. To enhance knowledge in latest consumer electronic products.

Outline Syllabus:An overview of the history of microelectronic industry and the milestones in the theory of microelectronic devices Advanced microelectronic devices and systems: submicrometer MOSFETs, FINFETs, non-volatile memories, SOI transistors and thin film transistors (TFTs), and nano-wire devices. Liquid Crystal Display (LCD) systems and Charge-Coupled Devices (CCDs) cameras. Short-channel effects: charge sharing effects, drain induced barrier lowering and gate induced leakage current. New materials for metals, gate dielectrics, and semiconductors. Fabrications: typical MOS process flow and techniques, wafer cleaning, deposition (CVD and PECVD), masks and lithography, ion implantation, metallization, oxidation, epitaxy, dry etching (plasma and reactive ions), isolation techniques, and device variabilities. Testing and reliabilities: typical procedure and techniques, time-dependent dielectric breakdown (TDDB) and stress-induced-leakage-currents (SILC), Fowler-Nordheim injection, interface states and space charges in the oxide, the high and low frequency differential capacitance-voltage techniques, hot carrier induced degradation, bias temperature instabilities, lifetime prediction.

Module Overview:
This module extends your knowledge of the state-of-the-art electronic devices and systems. The emphasis is on the differences between an advanced device and a traditional one. The fabrication, testing and reliability issues will be addressed.

Additional Information:This level 7 module extends a prospective student's knowledge of the state-of-the-art electronic devices and systems. The emphasis is on the differences between an advanced device and a traditional one. The fabrication, testing and reliability issues will be addressed.