Teaching Responsibility
LJMU Schools involved in Delivery:
Engineering
Learning Methods
Lecture
Tutorial
Module Offerings
7432MESI-JAN-CTY
Aims
To develop an understanding of the latest development and challenges encountered by the microelectronic industry.
To gain knowledge in the fabrication and testing of microelectronic devices.
To enhance knowledge in latest consumer electronic products.
Learning Outcomes
1.
Analyse the performance of latest consumer electronic products
2.
Critically appraise MOS fabrication process and techniques
3.
Critically evaluate testing techniques and appreciate reliability issues
Module Content
Outline Syllabus:
An overview of the history of microelectronic industry and the milestones in the theory of microelectronic devices. Advanced microelectronic devices and systems: submicrometer MOSFETs, FINFETs, NOR and NAND Flash memories, 3D memories, SRAM and DRAM, SOI transistors and thin film transistors (TFTs), and nano-wire devices. Liquid Crystal Display (LCD) systems and Charge-Coupled Devices (CCDs) cameras. Short-channel effects: charge sharing effects, drain induced barrier lowering and gate induced leakage current. New materials for metals, gate dielectrics, and semiconductors. Fabrications: typical MOS process flow and techniques, wafer cleaning, deposition (CVD and PECVD), masks and lithography, ion implantation, metallization, oxidation, epitaxy, dry etching (plasma and reactive ions), isolation techniques, and device variabilities. Testing and reliabilities: typical procedure and techniques, time-dependent dielectric breakdown (TDDB) and stress-induced-leakage-currents (SILC), Fowler-Nordheim injection, interface states and space charges in the oxide, the high and low frequency differential capacitance-voltage techniques, hot carrier induced degradation, bias temperature instabilities, lifetime prediction.
An overview of the history of microelectronic industry and the milestones in the theory of microelectronic devices. Advanced microelectronic devices and systems: submicrometer MOSFETs, FINFETs, NOR and NAND Flash memories, 3D memories, SRAM and DRAM, SOI transistors and thin film transistors (TFTs), and nano-wire devices. Liquid Crystal Display (LCD) systems and Charge-Coupled Devices (CCDs) cameras. Short-channel effects: charge sharing effects, drain induced barrier lowering and gate induced leakage current. New materials for metals, gate dielectrics, and semiconductors. Fabrications: typical MOS process flow and techniques, wafer cleaning, deposition (CVD and PECVD), masks and lithography, ion implantation, metallization, oxidation, epitaxy, dry etching (plasma and reactive ions), isolation techniques, and device variabilities. Testing and reliabilities: typical procedure and techniques, time-dependent dielectric breakdown (TDDB) and stress-induced-leakage-currents (SILC), Fowler-Nordheim injection, interface states and space charges in the oxide, the high and low frequency differential capacitance-voltage techniques, hot carrier induced degradation, bias temperature instabilities, lifetime prediction.
Module Overview:
This module will help you to develop an understanding of the latest development and challenges encountered by the microelectronic industry. Within the module, you will gain knowledge in the fabrication and testing of microelectronic devices. This will enhance your knowledge of the latest consumer electronic products.
This module will help you to develop an understanding of the latest development and challenges encountered by the microelectronic industry. Within the module, you will gain knowledge in the fabrication and testing of microelectronic devices. This will enhance your knowledge of the latest consumer electronic products.
Additional Information:
This level 7 module extends a prospective student's knowledge of the state-of-the-art electronic devices and systems. The emphasis is on the differences between an advanced device and a traditional one. The fabrication, testing and reliability issues will be addressed. UNESCO Sustainable Development Goals 1. Good Health and Wellbeing 2. Quality Education 3. Decent Work and Economic Growth 4. Industry, Innovation and Infrastructure 5. Responsible Consumption and Production 6. Climate Action 7. Partnerships for the Goals
This level 7 module extends a prospective student's knowledge of the state-of-the-art electronic devices and systems. The emphasis is on the differences between an advanced device and a traditional one. The fabrication, testing and reliability issues will be addressed. UNESCO Sustainable Development Goals 1. Good Health and Wellbeing 2. Quality Education 3. Decent Work and Economic Growth 4. Industry, Innovation and Infrastructure 5. Responsible Consumption and Production 6. Climate Action 7. Partnerships for the Goals
Assessments
Centralised Exam